Applications Open For 2017-18 Eskew+Dumez+Ripple Research Fellowship

NEW ORLEANS – Eskew+Dumez+Ripple announced its sixth annual Research Fellowship. The 2017/2018 Fellowship will support one outstanding individual for a full year as they conduct applied research in the field of Mysterious Skin—pushing the envelope on building enclosures.

         Building envelopes, from the humble brick wall to dynamic double-skin façades, can have huge impacts on occupant comfort, health, environmental impact and energy performance, Eskew+Dumez+Ripple reps said. The architecture firm wants applicants to think about how to make affordable envelopes that provide daylight and views while controlling glare,  how the building envelopes of historic structures can be upgraded for better performance without moisture drive endangering the very buildings we’re trying to save and how to best track the carbon impact of building envelope choices.

         Eskew+Dumez+Ripple is looking for soon-to-graduate students or recent graduates of professional programs in architecture, mechanical engineering or building science. Applications from dual majors or those with undergraduate degrees in one discipline and master’s degrees in another discipline are encouraged. If you are an architect who thinks like a mechanical engineer, or a building science major who loves to sketch, Eskew+Dumez+Ripple wants to hear from you.

         Fellowships are open to recent graduates or candidates currently pursuing professional degrees who have completed at least six semesters of academic coursework.

          Click here for more information and details regarding the application process

 

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